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Intel® 8/9th-Gen Coffee Lake Core™ i7/i5/i3 Fanless Computer with 2xGbE Ports, TPM Support Low Profile Chassis
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Ekskl. moms
Intel® 8/9 th-Gen Core™e 35W/ 65W LGA1151 CPU
Max. 64GB RAM
Intel Q370 Chipset
Intel UHD 620 Graphics
XLow-profile chassis with hot-swappable 2.5" HDD/ SSD tray
Rugged,
4x COM port (2x RS232, 2x RS232/422/485)
2x GigE ports, supporting 9.5 KB jumbo frame
M.2 2280 M key socket (Gen3 x4) supporting NVMe SSD or Intel® Optane™ memory
4x USB 3.1 Gen2 ports and 4x USB 3.1 Gen1 ports
VGA/DVI/DP triple independent display, supporting 4K2K resolutionwide
TPM 2.0
AMT 12.0
Temperature range from -25°C to 70°C fanless operation
CE/FCC Class A, according to EN 55032 & EN 55024SafetyUL62368-1, IEC62368-1
Quantity
Physically in stock
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Specifications
| CPU | Supporting Intel® 8th-Gen Coffee Lake 6-core CPU (LGA1151 socket, 35W/ 65W TDP) - Intel® Core™ i7-8700/ i7-8700T - Intel® Core™ i5-8500/ i5-8500T - Intel® Core™ i3-8100/ i3-8100T - Intel® Pentium® G5400/ G5400T - Intel® Celeron® G4900/ G4900T |
|---|---|
| Chipset | Intel® Q370 Platform Controller Hub |
| Andet | AMT Supports AMT 12.0 TPM Supports TPM 2.0 |
| Approval | CE/FCC Class A, according to EN 55032 & EN 55024 |
| Chok/Vibration | Vibration Operating, MIL-STD-810G, Method 514.6, Category 4 Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-I |
| Digital I/O | Optional ! NON IN STANDAR DELIVERY !! |
| Dimensioner | 240 mm (W) x 225 mm (D) x 79 mm (H) |
| Driftstemperatur | with 35W CPU -25°C ~ 70°C ** with 65W CPU -25°C ~ 70°C */** (configured as 35W TDP) -25°C ~ 50°C */** (configured as 65W TDP) |
| Ethernet | 2x Gigabit Ethernet ports by I219 and I210 |
| Forsyning | 1x 3-pin pluggable terminal block for 8~35VDC DC input |
| Grafik | Integrated Intel® UHD Graphics 630 |
| Hukommelse | Up to 64 GB DDR4 2666/2400 SDRAM (two SODIMM slots) |
| Luftfugtighed | 10% ~ 90% , non-condensing |
| Lyd | 1x 3.5 mm jack for mic-in and speaker-out |
| Montering | Wall-mounting (standard) or DIN-Rail mounting (optional) |
| mPCIe | 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA) |
| PoE | non |
| Porte | 2x software-programmable RS-232/422/485 ports (COM1/ COM2) 2x RS-232 ports (COM3/ COM4) |
| RAID niveau | RAID 0/1 |
| Storage | 1x front-accessible, hot-swappable 2.5" HDD/SSD tray 1x internal SATA port for 2.5" HDD/SSD installation, supporting RAID 0/ 1 |
| Udgange | 1x VGA connector, supporting 1920 x 1200 resolution 1x DVI-D connector, supporting 1920 x 1200 resolution 1x DisplayPort connector, supporting 4096 x 2304 resolution |
| Udvidelser | 1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation |
| USB | 4x USB 3.1 Gen2 (10 Gbps) ports 4x USB 3.1 Gen1 (5 Gbps) ports |
| Weight | 3.1 Kg |
Introducingrugged fanless embedded computers, the new EPC-IXGEN8 series, powered by Intel® 8th-Gen Core™ i processors with up to 6-core/ 12-thread architecture that offer a significant performance improvement over previous 6th or 7th-Gen platforms.
EPC-IXGEN8features the same level of ruggedness and versatility in a 79mm low-profile chassis. In addition to effective fanless design, EPC-IXGEN8 series features one front-accessible, hot-swappable HDD/ SSD tray which can be configured as RAID 0/1 when combined with the internal SATA port. It also leverages cutting-edge M.2 NVMe SSD technology for over 2000MB/s disk read/ write speed, or install an Intel® Optane™ memory for the ultimate system acceleration.
EPC-IXGEN8 series consolidates the latest Intel hexa-core CPU, high-speed I/O interfaces, super-fast disk access and flexible storage configuration to form a high-performance ruggedized embedded computer. I/O nterface to add on modules for application-specific I/Os.
Supporting Intel® 9th/ 8th-Gen CPU (LGA1151 socket, 65W/ 35W TDP)
- Intel® Core™ i7-8700/ i7-8700T/ i7-9700E/ i7-9700TE
- Intel® Core™ i5-8500/ i5-8500T/ i5-9500E/ i5-9500TE
- Intel® Core™ i3-8100/ i3-8100T/ i3-9100E/ i3-9100TE
- Intel® Pentium® G5400/ G5400T
- Intel® Celeron® G4900/ G4900T
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